Through-Silicon via Submount for Flip-Chip LEDs
OSLON® Submount CL, KW C3L5L1.TE | OSRAM Opto Semiconductors
Thermal characteristics and fabrication of silicon sub-mount based LED package - ScienceDirect
Application of micro/nano technology for thermal management of high power LED packaging – A review - ScienceDirect
Cross section of a flip-chip LED | Download Scientific Diagram
Pushing the boundaries of UV LED power
Submounts and Subcarriers | Components for Fiber-Optic Communication Modules | Ceramic Packages | Products | KYOCERA
Schematic of a deep UV LED heterostructure flip-chip mounted onto a... | Download Scientific Diagram
LED Substrates and Submounts | Cost Effective Ceramic Packaging
Techniques for Thermal Management in LED Lighting
LED Submount - Remtec
led-substrates-and-submounts - Remtec
Submount for high power LED 1-Submount for high power LED-Huabo(Suzhou) Thinfilm Technology Co.,ltd.
Human-centric lighting placing greater demands on LED... Smart2.0
Lumileds talks LED packaging - interview
ZEISS Microscopy Online Campus | Light-Emitting Diodes
Laser & Photo Diode Submounts | Thick & Thin Metallization | Plated Copper
Submounts and Subcarriers | Components for Fiber-Optic Communication Modules | Ceramic Packages | Products | KYOCERA
3D LED and IC wafer level packaging | Emerald Insight
LED Die Bonding | SpringerLink
US20130248913A1 - Highly reflective coating on led submount - Google Patents
Research status and prospects of deep ultraviolet devices
Analysis of electrical parameters of InGaN-based LED packages with aging - ScienceDirect
